PRN: Detailed Physical, Technology and Cost Analysis of HTC's Vive Virtual Reality Head-Mounted Display - Research and Markets

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Detailed Physical, Technology and Cost Analysis of HTC's Vive Virtual Reality Head-Mounted Display - Research and Markets


DUBLIN, Mar 16, 2017 /PRNewswire/ --

Research and Markets has announced the addition of the "HTC Vive Virtual Reality Head-Mounted Display: Complete Teardown Analysis" report to their offering.

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The Virtual Reality (VR) market has raised expectations extremely high. It is already worth several billion US dollars per year and growing rapidly, with millions of headsets due to be sold in coming years.

Three main companies lead this new market: HTC Corporation, Oculus VR, which was bought by Facebook in 2014 for $2 billion, and Sony Playstation.

They think this market has enough potential to invest billions of dollars to get ahead of their competitors. Most other major manufacturers also want good market shares, including Microsoft, Intel, Google, AMD, Samsung, Huawei, Archos and Alcatel.

Winning in this market is now HTC's all-or-nothing strategy. The HTC Vive VR Head-Mounted Display (HMD) is aimed at saving HTC from collapse. Vive VR can be used in different sectors, including gaming, entertainment, health, automotive, retail and education. It promises a premium VR experience.

This very well-designed system uses established components, including two 1200�-1080 pixel AMOLED displays manufactured by Samsung, for a total resolution of 2160�-1200 pixels. These are the main parts of the over 2850 electronic and mechanical components System Plus Consulting has identified in the headset. There are also several MCUs, FPGAs, processors, interface ICs, MEMS sensors, photodiodes, and a camera module including an Omnivision Global Shutter Motion Detector.

Based on a complete teardown of the HTC Vive VR Headset, this report is a detailed physical, technology and cost analysis.

Key Topics Covered:

Overview / Introduction

Executive Summary

- Main Chipset

- Block Diagram

- Reverse Costing Methodology

Company Profile

HTC Corporation

Physical Analysis

Content of the Box

- Views and Dimensions of the Headset

- Headset Opening

- Fresnel Lens Details

- Display Details

- Main Electronic Board

- Top side - overview

- Top side - high definition photo

- Top side - PCB markings

- Top side - main component markings

- Top side - main component identification

- Top side - other component markings

- Top side - other component identification

- Bottom side - high definition photo

- Bottom side - component identification

- IR Photodiode Flex

- Front Camera Flex

- Microphone Flex

- Proximity Sensor Flex

- Display Flex 1 & 2

Cost Analysis

Estimating the BOM

- PCB Cost

- BOM Cost - Main Electronic Board

- BOM Cost - IR Photodiode Flex

- BOM Cost - Front Camera Flex

- BOM Cost - Microphone Flex

- BOM Cost - Proximity Sensor Flex

- BOM Cost - Display Flex 1 & 2

- Housing Parts - Estimation

- BOM Cost - Housing

- Material Cost Breakdown by Sub-Assembly

- Material Cost Breakdown by Component Category

- Estimating Added Value (AV) cost

- Electronic Board Manufacturing Flow

- Details of the Main Electronic Board AV Cost

- Details of the System Assembly AV Cost

- Added-Value Cost Breakdown

- Manufacturing Cost Breakdown

Estimated Price Analysis

- Estimation of the Manufacturing Price

- Estimation of the Selling Price

Companies Mentioned


- Archos and Alcatel

- Facebook

- Google

- HTC Corporation

- Huawei

- Intel

- Microsoft

- Samsung

- Sony

For more information about this report visit

Media Contact:

Research and Markets
Laura Wood, Senior Manager

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