E-Beam Wafer Inspection System Market Size, Share | Industry Trends and Forecast 2020-2025

24/mar/2021 05:59:30 IMARC Group Contatta l'autore

According to IMARC Group's latest report, titled " E-Beam Wafer Inspection System Market Size : Industry Trends, Share, Growth, Opportunity and Forecast 2020-2025," the e-beam wafer inspection system to continue its moderate growth during the next five years .

 E-beam wafer inspection system is a fabrication tool for semiconductors that utilizes electron beam scanning of integrated circuit (IC) components or wafers. It identifies the defects in wafers and scans small sections of a die to determine specific, hard-to-detect, systematic and random defects. The inspection system compares the wafer with the image of the adjacent dies to determine the defected coordinates. The technique is widely used in manufacturing compact gadgets, smartphones, laptops, and tablets. E-beam wafer inspection system is also deployed in lithographic qualification, wafer dispositioning, and reticle quality optimization.

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Market Trends

The expanding consumer electronics sector has led to the rising adoption of semiconductors in manufacturing specialized devices and consumer electronics, thereby augmenting the demand for e-beam wafer inspection system. Additionally, the emergence of advanced automobile components, such as airbag controls, global positioning systems (GPS), anti-lock braking systems (ABS), and digital display devices, is also driving the market for the inspection system. They also aid in upgrading automated driving and collision detection technologies, thereby positively influencing the market growth. Moreover, several technological advancements have led to the introduction of more-efficient multi-beam inspection systems that reduce the overall time required for mass production

E-Beam Wafer Inspection System Market 2020-2025 Analysis and Segmentation:

Competitive Landscape:

The competitive landscape of the market has been studied in the report with the detailed profiles of the key players operating in the market.

Some of these key players include:

  • Aerotech Inc.
  • Applied Materials Inc.
  • ASML Holding NV
  • Hitachi Ltd.
  • KLA-Tener Corporation
  • Lam Research Corporation
  • Nanotronics Imaging Inc.
  • NXP Semiconductors NV (Qualcomm Incorporated)
  • Renesas Electronics Corporation
  • Synopsys Inc.
  • Taiwan Semiconductor
  • Teledyne Technologies.

The report has segmented the market on the basis of resolution, application, end use and region.

Breakup by Resolution:

  • Less than 1 nm
  • 1 nm to 10 nm
  • More than 10 nm

Breakup by Application:

  • Defect Imaging
  • Lithographic Qualification
  • Bare Wafer OQC / IQC
  • Wafer Dispositioning
  • Reticle Quality Inspection
  • Inspector Recipe Optimization

Breakup by End Use:

  • Communication Devices
  • Consumer Electronic Equipments
  • Automotive Parts
  • Others

Explore full report with table of contents: https://www.imarcgroup.com/e-beam-wafer-inspection-system-market

Breakup by Region:

  • North America
  • Asia Pacific
  • Europe
  • Latin America
  • Middle East and Africa

Browse Related Report:

https://www.imarcgroup.com/super-junction-mosfet-market

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